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Abstract The ability to control adhesion on demand is important for a broad range of applications, including the gripping and manipulation of objects in robotics and manufacturing, and the temporary attachment of wearable devices. Despite recent advances in tunable adhesive materials, most existing solutions have modest adhesion strength and are limited by a compromise between the maximum and minimum adhesion, where increased strength prevents the release of lighter objects. To overcome these challenges, thermally responsive polymers, which can exhibit both high stiffness and a large reduction in stiffness via heating, have the potential to enable strong and tunable adhesion. Here, a microstructured composite adhesive with high strength (>2 MPa) and dynamically tunable adhesion (16×) is realized using a solvent‐assisted molding technique. The adhesive consists of an array of composite micropillars whose small scale and material composition enable strong and tunable adhesion. While thermally actuated systems often have slow response times, it is shown that miniaturization allows response times to be reduced to <1s for heating and <10s for cooling. These strong, fast, and dynamically tunable adhesives offer advantages over existing solutions and can be manufactured for practical adoption through the scalable solvent‐assisted molding technique. 

Abstract Rapidly controlling and switching adhesion is necessary for applications in robotic gripping and locomotion, pick and place operations, and transfer printing. However, switchable adhesives often display a binary response (on or off) with a narrow adhesion range, lack post‐fabrication adhesion tunability, or switch slowly due to diffusion‐controlled processes. Here, pneumatically controlled shape and rigidity tuning is coupled to rapidly switch adhesion (≈0.1 s) across a wide range of programmable adhesion forces with measured switching ratios as high as 1300x. The switchable adhesion system introduces an active polydimethylsiloxane membrane supported on a compliant, foam foundation with pressure‐tunable rigidity where positive and negative pneumatic pressure synergistically control contact stiffness and geometry to activate and release adhesion. Energy‐based modeling and finite element computation demonstrate that high adhesion is achieved through a pressure‐dependent, nonlinear stiffness of the foundation, while an inflated shape at positive pressures enables easy release. This approach enables adhesion‐based gripping and material assembly, which is utilized to pick‐and‐release common objects, rough and porous materials, and arrays of elements with a greater than 14 000xrange in mass. The robust assembly of diverse components (rigid, soft, flexible) is then demonstrated to create a soft and stretchable electronic device.